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HMT-X1 Motherboard Layering Chip Glue Removal Heating Table Option:HMT-X1 Support manual / automatic white

SKU: 85419114709

4.5
USD26.99 USD56.99

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USA
  • USA
  • CAN

Ships within 48 hours · Estimated delivery Aug 27 - Sep 1

Description

Support manual / automatic white balance / one key white balance

Whether you're running a phone repair shop

and white background when saving front and rear camera photos and videos caused by non-original front cameras

solves the problem of repairing and fixing laptop motherboards

B-BOX adopts autonomous syscfg algorithm

HMT-X1 Motherboard Layering Chip Glue Removal Heating Table Option:HMT-X1 Support manual / automatic whiteHMT X1 ZJ X1 multi functional motherboard layered chip glue removal heating table for iPhone 16 15 14 13 12 11 X PCB layering tinning repair and chip glue removal. HMT X1 360W universal motherboard delamination and degumming heating table for mobile phone motherboard repair. Features: 1. Temperature control imported from Germany, rapid heating. 2. Turn on the chip degumming station temperature switch, the chip degumming station starts to heat up. 3.

Exchange/Return Notes
  • We offer a 30-day return/exchange service after receiving.
  • Final sale items are not eligible for returns or exchanges.
  • To process your return/exchange, please contact us at [email protected]
  • Please click here for more details>>> Return & Exchange Policy

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